Moscow, April 6, 2021 — RSC Group, the leading Russian developer and integrator of innovative ultrahigh-dense energy efficient solutions for HPC, data centers, cloud platforms and storage-on-demand systems has announced its RSC Tornado server computing nodes based on the latest 3rd Gen Intel Xeon Scalable processors and Intel Optane persistent memory 200 series have been launched by Intel Corporation worldwide today.
New generation of RSC Tornado solution is oriented on a wide range of demanding scientific research workloads and applied tasks. The updated portfolio of integrated software-defined and reconfigurable solutions targets classic HPC systems, efficient storage and data processing and will help create AI/ML/DL (Artificial Intelligence, Machine Learning, Deep Learning) systems. RSC Tornado solution provides the industry highest x86 architecture computing density of 967.45 Tflops per rack (+37% vs. previous generation), 2.45PB distributed RSC Storage on-Demand per rack (+36% vs. previous generation) with 3.67 TB/s IO bandwidth (2x vs. previous generation) and leading energy efficiency with 100% “hot water” liquid cooling of all electronic components, horizontal scalability from small systems with a few servers to huge clusters or server farms containing many thousands of server nodes. RSC Tornado solutions provide additional cost optimization benefits through support of open standards and new Intel server products.
RSC Tornado solution based on 3rd Gen Intel Xeon Scalable processors (up to 40 cores, TDP 270W), Intel Optane persistent memory 200 series, Intel SSDs and high-speed fabric 200 Gb/s has leading footprint and computing density (up to 153 nodes in one standard 42U rack), high energy efficiency and provides stable operation of computing nodes in “hot water” mode with cooling agent temperature up to +65°C at inlets of switching nodes and interconnects. Operation in “hot water” mode enables all-year free cooling (24x365) using only dry coolers running at ambient air temperature up to +50°C, and complete elimination of chillers. As the result, average power usage efficiency factor (PUE) is less than 1.04, which is an outstanding score for HPC industry.
RSC Storage on-Demand solutions support NFS/Lustre/DAOS storage systems in one rack. New Intel open source DAOS (Distributed Asynchronous Object Storage) storage system provides the highest speed of data access with various patterns. This solution is optimal for AI (ML/DL) segment. It enables multi-layered storage based on Lustre file system in Disaggregated Composable Infrastructure and flexible management of NVMe disk pools, and enhances these levels with high-performance components based on DAOS. RSC uses its experience of building composable disaggregated solutions in DAOS management with RSC BasIS orchestration platform with the new and much more effective user interface (UI).
‘We are very glad that our largest and longtime customers – Joint Supercomputer Center of Russian Academy of Sciences (JSCC RAS), Saint Petersburg Polytechnic University named after Peter the Great (SPbPU), Joint Institute for Nuclear Research (JINR) – look for opportunity to use new RSC Tornado solutions based on 3rd Gen Intel Xeon Scalable processors and Intel Optane persistent memory 200 series,’ – said Alexey Shmelev, Chief Operations Officer at RSC Group.
‘RSC's support for the latest 3rd Gen Intel Xeon Scalable processors, and for our unique open source DAOS storage system, illustrates their commitment to leading-edge HPC. RSC’s customers can achieve outstanding performance for diverse and challenging HPC applications in fields like manufacturing, finance, life sciences and more. Innovations in Xeon core architecture, memory bandwidth and security help ensure RSC users can minimize complexity and unleash the value of their data, and with Intel Speed Select Technology, users can personalize their infrastructure with multiple configurations to meet the needs of each workload,’ – said Trish Damkroger, Vice President and General Manager of High Performance Computing, Data Platforms Group at Intel.
3rd Gen Intel Xeon Scalable processors
Optimized for HPC workloads as well as for cloud, AI, enterprise, network, security and IoT applications 3rd Gen Intel Xeon Scalable processors, based on Intel’s 10nm process technology, feature up to 40 powerful cores and a wide range of frequencies, feature and power levels. New benefits include PCI Express 4.0 (PCIe-Gen4) support, increased memory bandwidth, memory capacity up to 6TB per processor/socket with Intel Optane persistent memory 200 series and additional Intel AVX-512 instructions.
New Intel server processor family is the only data center CPU with built-in AI acceleration, end-to-end data science tools, and a vast ecosystem of smart solutions. The platform includes Intel SGX (Intel Software Guard Extensions) which protects data and application code in real time from the edge to the data center and multi-tenant public cloud, enabling enhanced collaboration using shared data – without compromising privacy. 3rd Generation Intel Xeon Scalable processors deliver a 50-60% competitive lead for key HPC life sciences, financial services and manufacturing workloads.
Intel Optane persistent memory 200 series
The 3rd Gen Intel Xeon Scalable platform supports the latest Intel Optane persistent memory 200 series delivering up to 6TB total memory per socket, 32% higher memory bandwidth vs previous generation. Intel Optane persistent memory is a new category of devices that sits between memory and storage. It has the flexibility to augment memory capacity beyond what is available on DRAM-only systems, or as a new persistent memory tier delivering high performance and low latency for accelerated data processing. Intel Optane persistent memory 200 series is the next-generation persistent memory module and helps users to extract more value from larger datasets, with a unique memory tier that combines large capacity and native persistence. Intel Optane persistent memory 200 series supports Enhanced Asynchronous DRAM Refresh (eADR), a new platform feature that can save volatile data residing in DRAM and CPU caches in the event of a power failure, preventing data loss without expensive battery-based memories.
Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries.